Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure
Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure
Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure
Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure
Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure
Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure
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Low Temperature Curing Adhesive Factory - HG-529 for PCB Component Bonding 70-90℃ Cure

  • US$ 5.9

    ≥5000

  • US$ 6.5

    1000–4999

  • US$ 6.9

    100–999

Product Attribute

CAS No.: 529
Place of Origin: Jiangxi, China
Main Raw Material: Epoxy
Usage: Construction, Repairing scrubbers, ash handling systems, pipe elbows, screens, and chutes
Brand Name: HiGlue
Classification: Double Components Adhesives
EINECS No.: 215-691-6
MF: Al2O3
Other Names: Low-temperature curing adhesive for PCB
Type: Wear Guard High Load
curing time: 2.5 mins-5 mins
usage: Potting and sealing of electronic components
Other name: low temperature curing adhesive
Model Number: 529
Color: black /white
Storage: -20℃
Size: 55ml
Shelf life: 3 Months
OEM: YES
Company Type: China Direct Adhesive Factory
Selling Units: Single item
Single package size: 11X10X14 cm
Single gross weight: 0.690 kg

1 years

Main Products: Pipe, Sealing, Cord, Anaerobic, Adhesive, Series, Cyanoacrylate, Series, Epoxy, AB, Glue, Series, Silicon, Sealant, Series

Product information

Products Description

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Basic Information

  • Total Capitalization: NA
  • Year Established: NA
  • Total Employees: NA
  • Product Certificate: NA
  • Business Type: Trading Company

Trading Capabilities

  • Total Annual Revenue: NA
  • Export Percentage: NA
  • OEM Services: NA
  • Small Orders Accepted: NA
  • Brand Names: NA
  • Payment Terms: NA
  • Main Competitive Advantages: NA
  • Major Customer: NA
  • Export Markets: NA
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