IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray
IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray
IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray
IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray
IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray
IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray
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IC Chip Tray Manufacturer - BGA Series Anti-static High Temperature Tray

  • US$ 0.88

    ≥10000

  • US$ 0.99

    1000–9999

  • US$ 1.99

    100–999

Product Attribute

Plastic Type: PP
Custom Order: Accept
Process Type: Blister
Industrial Use: Electronic
Place of Origin: Guangdong, China
Model Number: ESD0090
Brand Name: ESDELES
Product name: IC Chip ESD Anti-Static Tray
Materials: Plastic
Size: 324mm * 136mm
IC Chip Specification: 10mm * 10mm * 2.0mm
Surface Resistance: 10e4-10e8ohms
Temperature: High withstand 150 ° C
Number of grids per plate: 16 * 6=96
Function: Antistatic
Application: IC Chip Memory Electronic Components
Material: plastic
Selling Units: Single item
Single package size: 40X30X20 cm
Single gross weight: 1.000 kg

1 years

Main Products: Top, Sale, Products, ESD, Mats, ESD, Bag

Product information

Products Description

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Basic Information

  • Total Capitalization: NA
  • Year Established: NA
  • Total Employees: NA
  • Product Certificate: NA
  • Business Type: Trading Company

Trading Capabilities

  • Total Annual Revenue: NA
  • Export Percentage: NA
  • OEM Services: NA
  • Small Orders Accepted: NA
  • Brand Names: NA
  • Payment Terms: NA
  • Main Competitive Advantages: NA
  • Major Customer: NA
  • Export Markets: NA
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